Click here to close now.

Welcome!

IoT User Interface Authors: Pat Romanski, Liz McMillan, Lori MacVittie, Frank McCourt, Sematext Blog

News Feed Item

Industrial Electronics - Global Trends, Estimates and Forecasts, 2011-2018

NEW YORK, Dec. 17, 2013 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Industrial Electronics - Global Trends, Estimates and Forecasts, 2011-2018
http://www.reportlinker.com/p01931098/Industrial-Electronics---Global-Trends-Estimates-and-Forecasts-2011-2018.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Manufacturing

Global Market Watch:
Primarily supported by application sectors:- semiconductor capital equipment, test and measuring (T&M) instruments, automation systems and process control instrumentation -- the Industrial Electronics market to witness a value of US$321 billion by 2018. Geographical analysis shows the highest Compounded Annual Growth Rate (CAGR) of 17.0% is foreseen from Asia-Pacific region during the analysis period 2011-2018. In terms of CAGR, Europe closely tracks North America, with a rate of 15%. Among the sectors, semiconductor capital equipment accounts for nearly 32.2% of the overall market share followed by process control instrumentation at 22.8% holding the second position.

Report Focus:
The report 'Industrial Electronics - Global Trends, Estimates and Forecasts, 2011-2018' reviews the latest industrial electronics market trends with a perceptive attempt to disclose the near-future growth prospects. An in-depth analysis on a geographic basis provides strategic business intelligence for electronics sector investments. The study reveals profitable investment strategies for electronics companies, business executives, product marketing managers, new business investors and many more in preferred locations.

The report primarily focuses on:
• Emerging Market Trends
• Advancements in the Technological Space
• Market Demand of The Segments (By-Region)
• Key Growth Areas and Market Size
• Region-Wise Demand Factor
• Key Competitors Edge
• Investment Strategies

Estimates are based on online surveys using customized questionnaires by our research team. Besides information from government databases, company websites, press releases & published research reports are also used for estimates.

The analysis primarily deals with applications. Further, the subdivided categories include:

Industrial Electronics - By Application
• Semiconductor Capital Equipment (Integrated Circuits (ICs), Semiconductor lithography equipment, Semiconductor Ion Implantation Equipment, Silicon Wafer Fabrication, Ion Implantation, Photolithography, Deposition, Etching, Cleaning and Mechanical and Chemical Polishing, Semiconductor Factory Automation).
• Process Control Instrumentation/Environmental Controls (Temperature Sensor, Architectures, Mechanisms and Algorithms for Maintaining the Output, Robotic Assembly)
• Test and Measuring (T&M) Instruments (Printed Circuit Boards (PCB), Bench-Top T&M Equipment and PC-Based T&M Equipment)
• Automation Systems (Machinery, Processes in Factories, Boilers and Heat Treating Ovens, Switching in Telephone Networks).
• Other (Material Handling, Industrial Robotics and Other Industrial Electronics, Etc.,)

The period considered for the industrial electronics market analysis is 2011-2018. The region wise distribution of the market consists of North America (USA, Canada and Mexico), Europe (Germany, France, United Kingdom, Russia, Spain, Italy and Rest of Europe), Asia-Pacific (China, Japan, South Korea, India and Rest of Asia-Pacific), and Rest of World (Brazil, South Africa, Israel, Argentina and Rest of Rest of World). The market growth rate in the major economies such as the U.S., Japan, China etc. are estimated individually.

More than 1346 leading market players are identified in electronics industry out of which 30 key companies in industrial electronics that project improved market activities in the near future are profiled. The report consists of 77 data charts describing the market shares, sales forecasts and growth prospects. Moreover, key strategic activities in the market including mergers/acquisitions, collaborations/partnerships, product launches/developments are discussed.

Key Companies Profiled
ALTERA CORPORATION (USA), ANALOG DEVICES, INC. (ADI) (USA), BLUERADIOS, INC. (USA), CACTUS SEMICONDUCTOR, INC (USA), DOVER CORPORATION (USA), GENERAL ELECTRIC COMPANY (GE) (USA), HONEYWELL (USA), INTEL (USA), FUJI ELECTRIC HOLDINGS COMPANY, LIMITED, (JAPAN), FUJITSU LIMITED (JAPAN), KHAITAN (INDIA), & many more….

Key Industry Activities
• OSRAM OPTO SEMICONDUCTORS
• IMATION LAUNCHES RDX® MEDIA SECURE WITH CYBERSAFE™ PRO SECURITY…
• NUVOTON INTRODUCES NUMICRO MINI51 SERIES BRAND NEW 32-BIT…
• ANALOG DEVICES LAUNCHES ADXL377, INDUSTRY-FIRST ANALOG 3-AXIS…
• CHELSIO LAUNCHES USS 2.1 – DELIVERS HIGH AVAILABILITY, ISCSI SCALING TO…
• DFI RELEASES DS912-OT, A NEW COMPACT EMBEDDED DESIGN SYSTEM
• EMERSON NETWORK POWER RELEASES TRELLIS™ PLATFORM TO UNIFY IT AND…
• APACER PIONEERS THE INTRODUCTION OF THE MEMORY MODULE WITH…
• APACER UNVEILS THE NEXT-GEN SDM4 MIDDLE PROFILE WIDE-TEMP…
• PITNEY BOWES ANNOUNCES DFWORKS® VERSION 3.0
• VISHAY INTERTECHNOLOGY LAUNCHES FOUR ENGINEERING DESIGN KITS FOR…
• NXP ANNOUNCES GREENCHIP FOR FLEXIBILITY IN HIGH-POWER LED DESIGN
• MINEBEA ANNOUNCES CSD-892-73, THE INDUSTRY'S SMALLEST…
• MENTOR GRAPHICS INTRODUCES NEXT GENERATION VELOCE®2 EMULATION…
• HENKEL'S NEWEST ABLESTIK DIE FIX TECHNOLOGY, FORMULATED EXCLUSIVELY…
• NXP UNVEILS INDUSTRY'S FIRST I2C-BUS CONTROLLERS SUPPORTING NEW… & many more….

TABLE OF CONTENTS

I. REPORT FOCUS

A. ELECTRONICS

DEFINITION
ELECTRONIC COMPONENTS – DEFINITION
EARLY ELECTRONIC COMPONENTS

TYPES OF CIRCUITS
ELECTRONIC COMPONENTS AND THEIR CLASSIFICATION
A. TERMINAL
B. CONNECTOR
C. CABLE ASSEMBLY
D. SWITCH
E. RESISTOR
F. CAPACITOR
G. TRANSDUCER
H. SENSOR
I. SEMICONDUCTORS
J. OPTOELECTRONIC DEVICES

HISTORY OF ELECTRONICS
ELECTRONICS BEFORE 20TH CENTURY
ELECTRONICS OF THE EARLY 20TH CENTURY
DISCOVERY OF THE TRANSISTOR EFFECT
THE ENDLESS JOURNEY OF ELECTRONICS AFTER TRANSISTOR
THE IMPACT OF ELECTRONICS ON COMPUTING
THE GLOBAL IMPACT OF COMPUTING

ELECTRONICS IN THE 21ST CENTURY
CONCLUSION

AN OVERVIEW OF KEY ELECTRONIC DEVICES

B. INDUSTRIAL ELECTRONICS

POWER ELECTRONICS
DEVICES
DC/AC CONVERTERS (INVERTERS)
POWER ELECTRONICS IN RESIDENTIAL AND PUBLIC APPLICATIONS

1. SEMICONDUCTOR CAPITAL EQUIPMENT
TRENDS IN IC TECHNOLOGY
TRENDS IN INDUSTRY METRICS

2. TEST & MEASUREMENT EQUIPMENT (T&M)

3. PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS
TYPES OF PROCESS CONTROL SYSTEMS

4. AUTOMATION OR AUTOMATIC CONTROL
TYPES OF AUTOMATION
ELECTRONIC DESIGN AUTOMATION (EDA OR ECAD) SYSTEMS
AUTOMATION SHORTCOMINGS

5. OTHER INDUSTRIAL ELECTRONICS
MATERIAL HANDLING
INDUSTRIAL ROBOTS
TYPES OF ROBOTS

C. INDUSTRIAL ELECTRONICS - APPLICATION - MARKET BRIEFING

NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD

II. MARKET ANALYSIS

INDUSTRIAL ELECTRONICS – APPLICATION – INDUSTRY SNAPSHOT

A. INDUSTRIAL ELECTRONICS - SEGMENTATION

INDUSTRIAL ELECTRONICS – BY GLOBAL
INDUSTRIAL ELECTRONICS – BY GEOGRAPHY
NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD

INDUSTRIAL ELECTRONICS - APPLICATION
INDUSTRIAL ELECTRONICS - APPLICATION - GEOGRAPHIC REGION
SEMICONDUCTOR CAPITAL EQUIPMENT
NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD

PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS
NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD

TEST AND MEASURING (T&M) INSTRUMENTS
NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD

SEMICONDUCTOR CAPITAL EQUIPMENT
NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD

OTHER INDUSTRIAL ELECTRONICS
NORTH AMERICA
EUROPE
ASIA-PACIFIC
REST OF WORLD


D. GROWTH RATE ANALYSIS

GLOBAL INDUSTRIAL ELECTRONICS MARKET GROWTH RATES

INDUSTRIAL ELECTRONICS – APPLICATION
GLOBAL INDUSTRIAL ELECTRONICS APPLICATION – MARKET GROWTH RATES

E. INVESTMENT FOCUS

III. INDUSTRY OVERVIEW

APPLICATIONS OF INDUSTRIAL ELECTRONICS
ELECTRONICS INDUSTRY IN SINGAPORE

DEVELOPMENT OF INTEGRATED ROBOTIC APPLICATIONS
APPLICATIONS
FUNDING AND FUTURE

A. INDUSTRY ACTIVITIES

MERGERS/ACQUISITIONS/AGREEMENTS/PATENTS GRANTS/JOINT VENTURES/TRENDS, ETC……
OSRAM OPTO SEMICONDUCTORS
IMATION LAUNCHES RDX® MEDIA SECURE WITH CYBERSAFE™ PRO SECURITY TECHNOLOGY – GLOBALLY THE FIRST RDX MEDIA WITH BUILT-IN ENCRYPTION TECHNOLOGY
NUVOTON INTRODUCES NUMICRO MINI51 SERIES BRAND NEW 32-BIT MCU POWERED BY THE ARM® CORTEX™-M0
ANALOG DEVICES LAUNCHES ADXL377, INDUSTRY-FIRST ANALOG 3-AXIS, HIGH-G MEMS ACCELEROMETER
CHELSIO LAUNCHES USS 2.1 – DELIVERS HIGH AVAILABILITY, ISCSI SCALING TO PETABYTE LEVEL FOR CLOUD INSTALLATIONS
DFI RELEASES DS912-OT, A NEW COMPACT EMBEDDED DESIGN SYSTEM
EMERSON NETWORK POWER RELEASES TRELLIS™ PLATFORM TO UNIFY IT AND FACILITIES MANAGEMENT FOR ADVANCED DATA CENTRE PERFORMANCE AND TCO
APACER PIONEERS THE INTRODUCTION OF THE MEMORY MODULE WITH HIGH-SPEED AND LOW POWER CONSUMPTION, DEDICATED TO EMBEDDED SYSTEMS
APACER UNVEILS THE NEXT-GEN SDM4 MIDDLE PROFILE WIDE-TEMP MODULAR SSD ADVANCED WRITE PROTECT BOOSTS DATA STORAGE SECURITY
PITNEY BOWES ANNOUNCES DFWORKS® VERSION 3.0

VISHAY INTERTECHNOLOGY LAUNCHES FOUR ENGINEERING DESIGN KITS FOR D/CRCW E3 THICK FILM CHIP RESISTORS
NXP ANNOUNCES GREENCHIP FOR FLEXIBILITY IN HIGH-POWER LED DESIGN
MINEBEA ANNOUNCES CSD-892-73, THE INDUSTRY'S SMALLEST DIGITAL CONVERSION MODULE
MENTOR GRAPHICS INTRODUCES NEXT GENERATION VELOCE®2 EMULATION PLATFORM WITH VIRTUALAB CAPABILITIES
HENKEL'S NEWEST ABLESTIK DIE FIX TECHNOLOGY, FORMULATED EXCLUSIVELY FOR HIGH POWER SEMICONDUCTOR DEVICES.
NXP UNVEILS INDUSTRY'S FIRST I2C-BUS CONTROLLERS SUPPORTING NEW ULTRA-FAST-MODE SPECIFICATION
NXP DISCLOSES WORLD'S SMALLEST LOGIC PACKAGE WITH THE LARGEST PADS
HYDROID ANNOUNCES NEXT-GENERATION AUV DESIGNED FOR SURVEY APPLICATIONS
IDT LAUNCHES A FAMILY OF LOW-POWER, HIGH-ACCURACY TEMPERATURE SENSORS FOR SOLID STATE DISK DRIVES

3D SEE-THROUGH CINEMATIC EXPERIENCE POWERED BY DIALOG SEMICONDUCTOR
MATROX RELEASES HIGHLY-TUNED I/O DEVICE DRIVERS FOR ADOBE CS5.5
GE RELEASES MULTILIN™ EPM 9900, A NEW HIGH-SPEED, HIGH-ACCURACY METER
GIGOPTIX ANNOUNCES PA CHIPSETS FOR HIGH-CAPABILITY E-BAND RADIOS.
ASAHI KASEI UNVEILS LOW POWER DSP FOR VOICE/AUDIO PROCESSING
IDT LAUNCHES THE WORLD'S MOST ADVANCED SINGLE-PHASE POWER METERING SOC FOR SMART GRID APPLICATIONS
AMD UNVEILS GRAPHICS TRIPLE PLAY: 3 GPUS IN 3 MONTHS
NXP LAUNCHES HIGH-PERFORMANCE SILICON TUNERS WITH ZERO-POWER LOOP-THROUGH FOR CABLE STBS
ASAHI KASEI ROLLS OUT AK4189, A DUAL TOUCH GESTURE TOUCH SCREEN CONTROLLER
TANTAMOUNT® SURFACE-MOUNT MOLDED TANTALUM CHIP - VISHAY INTERTECHNOLOGY
SUCCESSFUL SEA-TRIALS FOR NEW KONGSBERG K-MASTER PROVIDED WITH MULTI-PURPOSE SUPPLY VESSEL
TWIN CREEKS ANNOUNCES APPLICATIONS FOR SUPER SLIM SI, GE, GAN, SIC AND SAPPHIRE WAFERS.
SERVER TECHNOLOGY INTRODUCES SENTRY POWER SYSTEM AT DATACENTER DYNAMICS NYC

INDUSTRY'S FIRST HARDWARE INTEROPERABILITY OF FPGA AND RLDRAM 3 MEMORY INTERFACE STANDARD DEMONSTRATED BY XILINX AND MICRON
SKYBITZ RELEASES COMPREHENSIVE TRACKING SOLUTION FOR INTERMODAL INDUSTRY
MITSUBISHI ELECTRIC DEVELOPS M81738FP, A 1200V HIGH-VOLTAGE INTEGRATED CIRCUIT FOR INVERTER SYSTEMS
MITSUBISHI ELECTRIC DEVELOPS EV MOTOR SYSTEM WITH BUILT-IN SILICON CARBIDE INVERTER
NEW CISCO UNIFIED COMPUTING SYSTEM INNOVATIONS
ACUITY BRANDS UNVEILS WSD NGX WALL SWITCH SENSOR WITH CONVERTIBLE NEUTRAL/GROUND CONNECTION
AC POLYPROPYLENE FILM CAPACITOR WITH WIDE CAPACITANCE VISHAY INTERTECHNOLOGY
RAID-ON-CHIP CONTROLLERS BY PMC ANNOUNCED FOR HP PROLIANT GEN8 SERVERS AND SMART ARRAY ADAPTERS

SANBLAZE SUPPLIES 16G FIBRE CHANNEL STORAGE EMULATION TECHNOLOGY
SEMTECH INTRODUCES AVAILABILITY OF TOP- CLASS 51.0 GBPS SERDES FOR ULTRA-LONG HAUL TECHNOLOGIES
KEMET LAUNCHES INNOVATIVE ALUMINUM ELECTROLYTIC CAPACITORS SERIES
VACON IMPROVES VACON NXP FOR PREMIUM PERFORMANCE
WIDE TERMINAL THIN FILM CHIP RESISTORS IN COMPACT 0406 CASE SIZE
TEL LAUNCHES ACQUISITION OF OERLIKON SOLAR
SANMINA-SCI EXPANDS DESIGN PARTNERSHIP WITH GIGOPTIX FOR NEXT GENERATION 100G MODULATOR
INTERSIL'S LATEST ISIM V4.0 ONLINE TOOL MAKES SIMPLER POWER SUPPLY DEVICE AND MINIMIZE TIME-TO-MARKET
CINTERION'S INITIATIVE WITH ULTRA COMPACT PLUG AND PLAY M2M VERSATILE TERMINAL
ANALOG DEVICES UNVEILS INDUSTRY'S LOWEST POWER COMPLETE HART MODEM IC
NEW ATMEL STUDIO 6 – EXPANSION OF ARM CORTEX-M SERIES PROCESSOR PORTFOLIO FROM ATMEL

VIA INTRODUCES LATEST COMPUTER-ON-MODULE (COM) EXPRESS MODULE, THE VIA COME-8X90
VISHAY INTERTECHNOLOGY LAUNCHES NEW HIGH-SPEED PIN PHOTODIODES IN CLEAR- AND BLACK-EPOXY T1 PLASTIC PACKAGES AND MORE
OPTO 22 INCLUDES LATEST 1000 OHM RTD TEMPERATURE SENSING I/O MODULE
DATATUFF CAT 6 CORD SETS- FROM BELDEN INC.
ALD'S EH4205 TO ENHANCE ITS MICROPOWER STEP-UP LOW-VOLTAGE BOOSTER MODULE
RENESAS MOBILE INTRODUCES MP5232, THE FIRST INTEGRATED LTE TRIPLE-MODE PLATFORM
KONICA MINOLTA DEVELOPS INDUSTRY-FIRST TINY-DROP-SIZE & HIGH-ACCURACY INKJET PRINTHEAD
MEDIATEK ANNOUNCES NEW MT6575 ANDROID PLATFORM
RAMBUS PURCHASES UNITY SEMICONDUCTOR
MICROCHIP LAUNCHES TECHNICAL TRAINING SERIES IN CHINA FOR MIGRATION OF APPLICATIONS AMONG 8, 16 AND 32-BIT MCUS
MITSUBISHI ELECTRIC DEVELOPS ULTRA-HIGH-SPEED ELEVATOR TECHNOLOGIES
X-FAB USES SILICON FRONTLINE'S POST-LAYOUT EXTRACTION SOFTWARE TO IMPROVE ITS HIGH END MIXED-SIGNAL PROCESS DESIGN MODULE
POWER METAL STRIP® METER SHUNT- VISHAY INTERTECHNOLOGY

FEMTOSECOND LASER TECHNOLOGY
STORAGE CHOKES FOR HIGH CURRENTS- COMPACT INDUCTORS
LATEST MULTIPLE CIRCUIT ANNOUNCED BY POWEREX FOR LOW-PROFILE SIC MOSFET APPLICATIONS
INTERSIL'S 40V QUAD PRECISION AMPLIFIERS DISPLAY LOWEST NOISE, MINIMUM POWER CONSUMPTION
RAMTRON LAUNCHES WORLD'S LOWEST ENERGY NONVOLATILE MEMOR
INTERSIL LAUNCHES INDUSTRY'S LOWEST VOLTAGE, MICROPOWER RS-485/RS-422 TRANSCEIVER FAMILY
LINEAR POSITION HALL EFFECT WITH SHORT ELECTRICAL STROKES SENSOR UNVEILED BY VISHAY INTERTECHNOLOGY
GE ENERGY RENAMES ACQUIRED CONVERTEAM AS POWER CONVERSION
RENESAS ELECTRONICS LAUNCHES NEW V850E2P MICROCONTROLLER SERIES WITH BUILT-IN RESOLVER SENSOR INTERFACE

SLVU2.8-8G, 500 WATT ULTRA LOW CAPACITANCE TVS SERIES
AVAGO TECHNOLOGIES LAUNCHES MGA-43128, A LINEAR POWER AMPLIFIER FOR 4G LTE CELLULAR INFRASTRUCTURE EQUIPMENT
CRYDOM LAUNCHES THE GROWTH OF ITS TRIUMPHANT SERIES H1 OF PANEL MOUNTED HIGH VOLTAGE AC OUTPUT SOLID STATE RELAYS
FIRST 120HZ SOC SOLUTIONS FOR HIGH-END SMART TV'S LAUNCHED BY MEDIATEK INC.,
LEXAR UNVEILS INDUSTRY'S FIRST 1000X MEMORY CARD
DFI LAUNCHES DS910-CD FOR FANLESS COOLING AND LOW POWER CONSUMPTION
COST-EFFECTIVE EMC FILTERS FROM TDK-EPC CORPORATION
VECTRON INTERNATIONAL -GEN II TEMP TRACKR
VISHAY INTERTECHNOLOGY ANNOUNCES NEW SURFACE-MOUNT RF CAPACITORS WITH INDUSTRY'S HIGHEST SRF FOR APPLICATIONS UP TO 20 GHZ FREQUENCIES
TOKYO ELECTRON UNVEILS SUCCESSFUL WAFER LEVEL DYNAMIC TESTING OF A POWER DEVICE
RENESAS ELECTRONICS INTRODUCES THE R2A20055NS, A COMPACT LITHIUM-ION BATTERY CHARGING CONTROL IC
NEW POWER INTEGRITY ADVANCE MODULE INTRODUCED FOR CADSTAR 13.0
SIGNAL CONDITIONING ICS - VISHAY INTERTECHNOLOGY
COMPLETE DIGITAL AUDIO PLATFORM- FROM ATMEL
LPKF LAUNCHES THE PROTOLASER U3 AT 2011 PRODUCTRONICA TRADE FAIR
DATATRONIC TO SHOWCASE AT APEC 2012
ATMEL LAUNCH FOR ANIMAL IDENTIFICATION APPLICATIONS - COST EFFECTIVE LF RFID IC
YOKOGAWA IMPROVES FA-M3V RANGE-FREE MULTI-CONTROLLER
±25 PPM XPRESSO OSCILLATORS FROM FOX ELECTRONICS FUNCTIONAL OVER WIDE TEMPERATURE RANGE

ALPS DEVELOPS MASS PRODUCTION OF "HSHCA SERIES" CAPACITIVE HUMIDITY SENSOR AND STARTS MASS PRODUCTION
APACER LAUNCHES THE AM404 CARD READER WITH A COOL ALUMINUM DESIGN AND A DAZZLING BLUE LED
MEMS MANUFACTURING COMMENCEMENT ANNOUNCED BY MICREL AT SAN JOSE, CA FAB
MEDIATEK LAUNCHES WORLD'S SMALLEST SINGLE-STREAM 802.11N WI-FI SOLUTION FOR MOBILE DEVICES
SUPERIOR-PERFORMANCE HOTMELTS FOR ELECTRONIC ELEMENTS
NEW LOOP BACK RELAY SERIES (TELEDYNE RELAYS)
3KW TVS DIODE IN A 2 LEAD DFN DESIGN
NXP LAUNCHES LDO WITH SUPERIOR- PERFORMANCE IN A SMALL WAFER-LEVEL CHIP-SCALE PACKAGE
ARECA INTRODUCES ARC-1882 SERIES THE 2ND-GENERATION 6 GB/S SAS RAID ADAPTERS
YOKOGAWA ANNOUNCES DTSX200 DISTRIBUTED TEMPERATURE SENSOR
CEITEC S.A. DECLARES VOLUME PRODUCTION OF THE CHIP DO BOI DEVICE
CRYDOM INTRODUCES THE "POWERPLUSDC" SERIES OF PANEL MOUNTED HIGH CURRENT DC OUTPUT SOLID STATE RELAYS

ZUKEN UNVEILS FASTER DESIGN AND IMPROVED COMMUNICATIONS BETWEEN LOGICAL DESIGN AND PCB LAYOUT
MICRO ANALOG SYSTEMS OY LAUNCHES MAS6502, A PIEZORESISTIVE SENSOR SIGNAL INTERFACE IC
DIALOG SEMICONDUCTOR ANNOUNCES SMARTPULSE IP OPPORTUNITY FOR WIRELESS SENSOR NETWORKS
BOURNS COLLABORATION WITH MAGNACHIP - VOLUME RAMP OF TBU® SERIES OF HIGH-SPEED CIRCUIT PROTECTION DEVICES
OSCILLATOR FOR HOLDOVER APPLICATIONS FROM VECTRON INTERNATIONAL
NEW LED PROTOTYPES INCLUDES DYNAMISM TO LED LIGHTING FOR HEADLIGHTS
TEKTRONIX LAUNCHES CALWEB® VERSION 5.1.5
AMPHENOL LAUNCHES MAX-M12 CONNECTOR
SAPPHIRE LAUNCHES HD 6870 DIRT3 SPECIAL EDITION
ZUKEN UNVEILS SYSTEM-LEVEL ELECTRONICS DESIGN ENVIRONMENT
EPCOS 'POWER' CAPACITORS- POWERED BY HIGH DIELECTRIC STRENGTH FOR WIND POWER PLANTS
"FORESTRY PRO" BY NIKON
IDT RELEASES THE WORLD'S HIGHEST PERFORMANCE GEN 3 PCI EXPRESS SWITCH FOR SSD STORAGE ARRAYS AND CLOUD COMPUTING APPLICATIONS

RENESAS ELECTRONICS INTRODUCES SUPERH MICROCONTROLLERS SH726A AND SH726B
INTERSIL LAUNCHES WORLD'S FIRST HIGH SPEED, DUAL CHANNEL 6A MOSFET DRIVER
YOKOGAWA INTRODUCES ISA100.11A-BASED YTMX580 MULTI-INPUT TEMPERATURE TRANSMITTER
"SEC WAVEMILL WFX" RELEASES - INDEX ABLE SHOULDER MILLING CUTTERS
IBM DEVELOPS POWER LICENSING AS LEADING DEVELOPERS EYE NEW APPLICATIONS
INDUCTORS: HAVING HIGHEST INDUCTANCE (TDK-EPC CORPORATION)
BOURNS INC. - TWO NEW INDUSTRIAL-GRADE PANEL CONTROL MODELS
INTERSIL LAUNCHES INDUSTRY'S HIGHEST PERFORMANCE INTEGRATED BUCK-BOOST REGULATOR
GE ENERGY RELEASES DISTRIBUTION AUTOMATION CONTROLLERS TO MAXIMIZE GRID EFFICIENCY AND RELIABILITY
LSI INTRODUCES MEGARAID CACHECADE PRO 2.0 SSD CACHING SOFTWARE FOR APPLICATION ACCELERATION
YOKOGAWA INTRODUCES DEVELOPMENT OF NEW VERSION OF CENTUM® VP
CRYDOM LAUNCHES THE DP SERIES OF PANEL MOUNTED HIGH CURRENT DC LOAD SOLID STATE CONTACTORS
NXP LAUNCHES TRANSMISSION LINE ESD SAFEGUARDS FOR HDMI TRANSMITTERS
LSI RELEASES CACHEVAULT FLASH CACHE PROTECTION FOR MEGARAID 6GB/S SATA+SAS CONTROLLERS

IMPROVED MEMS CLOCK OSCILLATOR FROM VECTRON INTERNATIONAL
LATTICE ROLLS OUT NEW DIAMOND DESIGN SOFTWARE FOR LOW POWER, COST SENSITIVE FPGA APPLICATIONS
APACER'S INTRODUCES NEW ULTRA-SLIM PROFILE SATA 7-PIN SSD SERIES
PMC RELEASES FIRST TRUE HARDWARE 6GB/S SATA/SAS RAID WITH ON-BOARD DRAM CACHE FOR ENTRY-LEVEL MARKET SEGMENT
ALLEGRO MICROSYSTEMS, INC. INTRODUCES NEW UNIPOLAR TWO-PHASE MICROSTEPPING MOTOR DRIVER
IDT RELEASES THE INDUSTRY'S WIDEST-RANGE, SMALL-FOOTPRINT SPREAD SPECTRUM CLOCK GENERATORS
VIZIO ENTERS INTO HIGH GROWTH LED LIGHTING INDUSTRY
ALPS DEVELOPS RDC90 SERIES COMPACT LONG-LIFE ROTARY SENSOR
CRYDOM INTRODUCES THE "LIFEPLUS SERIES" OF PLUGGABLE AC & DC OUTPUT ALL SOLID STATE RELAYS
NXP PIONEERS "EXTREMELY RUGGED" XR LDMOS RF POWER TRANSISTORS
AUSTRIAMICROSYSTEMS ROLLS OUT AS5410 ABSOLUTE LINEAR POSITION SENSOR IC, THE FIRST PRODUCT OF 3D HALL PLATFORM
AMPHENOL INDUSTRIAL EXPANDS NEPTUNE CONNECTORS PRODUCT LINE
AVAGO TECHNOLOGIES LAUNCHES ASMT-UWB1 HIGH-BRIGHTNESS LEDS IN DURABLE SURFACE MOUNT PACKAGE

ZUKEN UNVEILS NEW POWER INTEGRITY SOFTWARE FOR ANALYSIS OF HIGH-SPEED PCBS
IDT LAUNCHES THERMAL SENSOR FOR DDR3 MEMORY MODULES TO EXPAND CLOUD COMPUTING PORTFOLIO
COSMIC CIRCUITS ANNOUNCES 28NM, 40NM, 65NM AND 85NM MIPI PHY IP FOR TSMC TECHNOLOGY
SILICON MOTION ANNOUNCES FERRISSD™- THE ULTIMATE SINGLE-CHIP SOLID STATE DRIVE FOR EMBEDDED SOLUTIONS
230°C ULTRA-HIGH TEMPERATURE CRYSTAL OSCILLATOR - VECTRON INTERNATIONAL
APACER PROUDLY UNVEILS LAUNCHES QUICK CLIP-AND-SWIVEL AH130
DESTRON FEARING TO INTRODUCES EXPANDED LINE OF RFID FISH TRACKING PRODUCTS
RENESAS ELECTRONICS INTRODUCES THIRD GENERATION USB 3.0 HOST CONTROLLERS WITH INDUSTRY-LEADING TRANSFER SPEED AND LOW POWER CONSUMPTION
SNOM TECHNOLOGY ANNOUNCES HARDWARE-BASED IP PBX SOLUTION– SNOM ONE PLUS FOR SMALL AND SEMI LARGE TRADE ENTERPRISES
YOKOGAWA METERS & INSTRUMENTS ANNOUNCES WT1800 PRECISION POWER ANALYZER
YOKOGAWA UNVEILS GLOBAL MARKET RELEASE FOR FA-M3V
IDT LAUNCHES THE FIRST FULLY JEDEC-COMPLIANT MEMORY BUFFER FOR DDR3 LRDIMM
IDT LAUNCHES THE FIRST SINGLE-LAYER MULTI-TOUCH CAPACITIVE TOUCH SCREEN CONTROLLER
AVAGO TECHNOLOGIES ANNOUNCES ISOLATION AMPLIFIERS WITH GREATER PRECISION FOR MOTOR DRIVERS AND RENEWABLE ENERGY POWER CONVERTERS
RENESAS ELECTRONICS INTRODUCES R8C/3MQ GROUP OF MCUS WITH WIRELESS COMMUNICATION FUNCTIONS
SEMTECH DEVELOPS EFFICIENT, HIGH-PERFORMANCE ECOSPEED™ REGULATOR PLATFORM WITH 24V, 3A DEVICE - SC410
PMC-SIERRA ANNOUNCES FIRST 6GB/S UNIFIED SERIAL RAID CONTROLLER CHANNEL STORAGE SOLUTION WITH ZERO-MAINTENANCE CACHE PROTECTION
YOKOGAWA DEVELOPS ST6731 FPD DRIVER TEST SYSTEM
AVAGO TECHNOLOGIES ANNOUNCES THE LATEST ROBUST FIBER OPTIC LINKS FOR ADVERSE TEMPERATURE ENVIRONMENTS
THE NEW MULTITURN PRECISION POTENTIOMETER SLIP CLUTCH OPTION- BOURNS INC.
KEMET LAUNCHES T522 REDUCED LEAKAGE CONDUCTIVE POLYMER CAPACITOR SERIES
WEG UNVEILS NEW WATER JACKET-COOLED GENERATORS

APPLIEDMICRO PACKETPRO™ MULTICORE PROCESSOR FAMILY TO OFFER INTELLIGENT SOC MANAGEMENT FOR EMBEDDED APPLICATIONS
INEOQUEST UNVEILS EXPEDUS DVA AS BREAKTHROUGH INDUSTRY SOLUTION FOR INTEGRATED QUALITY OF SERVICE AND QUALITY OF EXPERIENCE
PANASONIC LAUNCHES "TOUGH IP" SERIES OF DUST AND WATER RESISTANT CORDLESS POWER TOOLS
RITEK LAUNCHES PORTABLE HARD DRIVE RIDATA RPD 720
IDT LAUNCHES THE FIRST EVER PCI EXPRESS® GEN3 FAMILY OF TIMING DEVICES
TOKYO ELECTRON DEVELOPS PROBUS-SIC™, A CVD TOOL USED IN EPITAXIAL FILM GROWTH ON SILICON CARBIDE SUBSTRATES
YOKOGAWA DEVELOPS FAST/TOOLS R9.03 SCADA SYSTEM
GLOBALFOUNDRIES TO LAUNCH GLOBALSOLUTIONS, A GLOBAL PARTNER ECOSYSTEM
APACER UNVEILS THE 4TH-GENERATION INDUSTRIAL CF CARD BY LEVERAGING UDMA-6 TECHNOLOGY
NVE LAUNCHES ISOLATED CAN TRANSCEIVER
SAPPHIRE RELEASES TOXIC AND VAPOR-X HD 5850
APACER INTRODUCES FLASH DRIVE HANDY STENO AH110 DURABLE, ULTRA-SLENDER-AND-LIGHT, COMBINING CLASSINESS WITH RELIABILITY

B. KEY COMPANY PROFILES

NORTH AMERICA
ASIA-PACIFIC
EUROPE
LATIN AMERICA

IV. INDUSTRY COMPANY DATABASE

A. INDUSTRIAL ELECTRONICS – COMPANY DATABASE
B. ELECTRONICS – INDUSTRY COMPANY DATABASE

V. APPENDIX

RESEARCH FOCUS
ABOUT AXIS RESEARCH MIND
DISCLAIMER
FEEDBACK

LIST OF TABLES AND CHARTS

I. REPORT FOCUS

G. INDUSTRIAL ELECTRONICS - APPLICATION - MARKET BRIEFING
NORTH AMERICA
1. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER FOR NORTH AMERICA CURRENT TRENDS, ESTIMATES & FORECASTS - (2011-2018) IN USD$ MILLION
2. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - % OF NORTH AMERICAN MARKET VALUE - (2014 - 2018)

EUROPE
3. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER FOR EUROPE CURRENT TRENDS, ESTIMATES & FORECASTS - (2011-2018) IN USD$ MILLION
4. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - % OF EUROPEAN MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
5. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER FOR ASIA-PACIFIC CURRENT TRENDS, ESTIMATES & FORECASTS - (2011-2018) IN USD$ MILLION
6. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - % OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
7. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER FOR REST OF WORLD CURRENT TRENDS, ESTIMATES & FORECASTS - (2011-2018) IN USD$ MILLION
8. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - % OF REST OF WORLD MARKET VALUE - (2014 - 2018)

II. MARKET ANALYSIS

9. GLOBAL INDUSTRIAL ELECTRONICS - SEGMENTATION BY APPLICATION MARKETS

INDUSTRIAL ELECTRONICS – BY GLOBAL
10. INDUSTRIAL ELECTRONICS MARKET - GLOBAL TRENDS, ESTIMATES & FORECASTS - (2011-2018) IN USD$ MILLION

INDUSTRIAL ELECTRONICS – BY GEOGRAPHY
11. INDUSTRIAL ELECTRONICS MARKET - GEOGRAPHIC REGION CURRENT TRENDS, ESTIMATES & FORECASTS FOR NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD - (2011-2018) IN USD$ MILLION
12. INDUSTRIAL ELECTRONICS MARKET - % OF NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD MARKET VALUE - (2014 - 2018)

NORTH AMERICA
13. INDUSTRIAL ELECTRONICS MARKET - USA, CANADA AND MEXICO - (2011-2018) IN USD$ MILLION
14. INDUSTRIAL ELECTRONICS MARKET - % OF USA, CANADA AND MEXICO MARKET VALUE - (2014 - 2018)

EUROPE
15. INDUSTRIAL ELECTRONICS MARKET - GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE - (2011-2018) IN USD$ MILLION
16. INDUSTRIAL ELECTRONICS MARKET - % OF GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
17. INDUSTRIAL ELECTRONICS MARKET - CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC - (2011-2018) IN USD$ MILLION
18. INDUSTRIAL ELECTRONICS MARKET - % OF CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
19. INDUSTRIAL ELECTRONICS MARKET - BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2011-2018) IN USD$ MILLION
20. INDUSTRIAL ELECTRONICS MARKET - % OF BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD MARKET VALUE - (2014 - 2018)

INDUSTRIAL ELECTRONICS - APPLICATION
21. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER FOR GLOBAL TRENDS, ESTIMATES & FORECASTS - (2011-2018) IN USD$ MILLION
22. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - % OF GLOBAL MARKET VALUE - (2014 - 2018)

INDUSTRIAL ELECTRONICS - APPLICATION - GEOGRAPHIC REGION
SEMICONDUCTOR CAPITAL EQUIPMENT
23. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT BY GEOGRAPHIC REGION CURRENT TRENDS, ESTIMATES & FORECASTS FOR NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD - (2011-2018) IN USD$ MILLION
24. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT - % OF NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD MARKET VALUE BY GEOGRAPHIC REGION - (2014 - 2018)

NORTH AMERICA
25. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT FOR USA, CANADA AND MEXICO - (2011-2018) IN USD$ MILLION
26. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT - % OF USA, CANADA AND MEXICO MARKET VALUE - (2014 - 2018)

EUROPE
27. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT FOR GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE - (2011-2018) IN USD$ MILLION
28. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT - % OF GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
29. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT FOR CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC - (2011-2018) IN USD$ MILLION
30. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT - % OF CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
31. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT FOR BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2011-2018) IN USD$ MILLION
32. INDUSTRIAL ELECTRONICS APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT - % OF BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2014 - 2018)

PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS
33. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS BY GEOGRAPHIC REGION CURRENT TRENDS, ESTIMATES & FORECASTS FOR NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD - (2011-2018) IN USD$ MILLION
34. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS - % OF NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD MARKET VALUE BY GEOGRAPHIC REGION - (2014 - 2018)

NORTH AMERICA
35. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS FOR USA, CANADA AND MEXICO - (2011-2018) IN USD$ MILLION
36. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS - % OF USA, CANADA AND MEXICO MARKET VALUE - (2014 - 2018)

EUROPE
37. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS FOR GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE - (2011-2018) IN USD$ MILLION
38. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS - % OF GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
39. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS FOR CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC - (2011-2018) IN USD$ MILLION
40. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS - % OF CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
41. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS FOR BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2011-2018) IN USD$ MILLION
42. INDUSTRIAL ELECTRONICS APPLICATION - PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS - % OF BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2014 - 2018)

TEST AND MEASURING (T&M) INSTRUMENTS
43. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS BY GEOGRAPHIC REGION CURRENT TRENDS, ESTIMATES & FORECASTS FOR NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD - (2011-2018) IN USD$ MILLION
44. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS - % OF NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD MARKET VALUE BY GEOGRAPHIC REGION - (2014 - 2018)

NORTH AMERICA
45. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS FOR USA, CANADA AND MEXICO - (2011-2018) IN USD$ MILLION
46. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS - % OF USA, CANADA AND MEXICO MARKET VALUE - (2014 - 2018)

EUROPE
47. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS FOR GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE - (2011-2018) IN USD$ MILLION
48. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS - % OF GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
49. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS FOR CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC - (2011-2018) IN USD$ MILLION
50. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS - % OF CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
51. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS FOR BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2011-2018) IN USD$ MILLION
52. INDUSTRIAL ELECTRONICS APPLICATION - TEST AND MEASURING (T&M) INSTRUMENTS - % OF BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2014 - 2018)

SEMICONDUCTOR CAPITAL EQUIPMENT
53. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS BY GEOGRAPHIC REGION CURRENT TRENDS, ESTIMATES & FORECASTS FOR NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD - (2011-2018) IN USD$ MILLION
54. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS - % OF NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD MARKET VALUE BY GEOGRAPHIC REGION - (2014 - 2018)

NORTH AMERICA
55. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS FOR USA, CANADA AND MEXICO - (2011-2018) IN USD$ MILLION
56. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS - % OF USA, CANADA AND MEXICO MARKET VALUE - (2014 - 2018)

EUROPE
57. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS FOR GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE - (2011-2018) IN USD$ MILLION
58. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS - % OF GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
59. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS FOR CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC - (2011-2018) IN USD$ MILLION
60. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS - % OF CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
61. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS FOR BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2011-2018) IN USD$ MILLION
62. INDUSTRIAL ELECTRONICS APPLICATION - AUTOMATION SYSTEMS - % OF BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2014 - 2018)

OTHER INDUSTRIAL ELECTRONICS
63. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS BY GEOGRAPHIC REGION CURRENT TRENDS, ESTIMATES & FORECASTS FOR NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD - (2011-2018) IN USD$ MILLION
64. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS - % OF NORTH AMERICA, EUROPE, ASIA-PACIFIC AND REST OF WORLD MARKET VALUE BY GEOGRAPHIC REGION - (2014 - 2018)

NORTH AMERICA
65. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS FOR USA, CANADA AND MEXICO - (2011-2018) IN USD$ MILLION
66. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS - % OF USA, CANADA AND MEXICO MARKET VALUE - (2014 - 2018)

EUROPE
67. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS FOR GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE - (2011-2018) IN USD$ MILLION
68. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS - % OF GERMANY, FRANCE, UNITED KINGDOM, RUSSIA, SPAIN, ITALY AND REST OF EUROPE MARKET VALUE - (2014 - 2018)

ASIA-PACIFIC
69. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS FOR CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC- (2011-2018) IN USD$ MILLION
70. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS - % OF CHINA, JAPAN, SOUTH KOREA, INDIA AND REST OF ASIA-PACIFIC MARKET VALUE - (2014 - 2018)

REST OF WORLD
71. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS FOR BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2011-2018) IN USD$ MILLION
72. INDUSTRIAL ELECTRONICS APPLICATION - OTHER INDUSTRIAL ELECTRONICS - % OF BRAZIL, SOUTH AFRICA, ISRAEL, ARGENTINA AND REST OF REST OF WORLD - (2014 - 2018)

D. GROWTH RATE ANALYSIS
73. INDUSTRIAL ELECTRONICS MARKET - GEOGRAPHIC REGION - % GROWTH RATE FORECASTS - (2011-2018)

INDUSTRIAL ELECTRONICS – APPLICATION
74. INDUSTRIAL ELECTRONICS APPLICATION - % GROWTH RATE FORECASTS FOR SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - (2011-2018)

E. INVESTMENT FOCUS
75. INDUSTRIAL ELECTRONICS - FORECASTED CAGR% - VALUE - 2011-2018 - TOP 7 COUNTRIES - INDIA, JAPAN, SOUTH KOREA, USA, RUSSIA, GERMANY, CHINA AND BRAZIL
76. INDUSTRIAL ELECTRONICS - BY APPLICATION - SEMICONDUCTOR CAPITAL EQUIPMENT, PROCESS CONTROL INSTRUMENTATION/ENVIRONMENTAL CONTROLS, TEST AND MEASURING (T&M) INSTRUMENTS, AUTOMATION SYSTEMS AND OTHER - FORECASTED CAGR% - VALUE - 2011-2018 - TOP 7 COUNTRIES - INDIA, JAPAN, SOUTH KOREA, USA, RUSSIA, GERMANY, CHINA AND BRAZIL

III. INDUSTRY OVERVIEW

77. WORLDWIDE KEY PLAYERS INTO INDUSTRIAL ELECTRONICS INDUSTRY THAT PROJECT IMPROVED MARKET ACTIVITIES IN THE NEAR FUTURE



KEY COMPANY PROFILES

NORTH AMERICA
ALTERA CORPORATION (USA)
ANALOG DEVICES, INC. (ADI) (USA)
BLUERADIOS, INC. (USA)
CACTUS SEMICONDUCTOR, INC (USA)
DOVER CORPORATION (USA)
GENERAL ELECTRIC COMPANY (GE) (USA)
HONEYWELL (USA)
INTEL (USA)
MAXIM INTEGRATED PRODUCTS (USA)
NANTERO., INC (USA)
SYMANTEC (USA)
TERADYNE, INC. (USA)
TEXAS INSTRUMENTS (USA)

ASIA-PACIFIC
BRITISH PHYSICAL LABORATORIES INDIA PVT LTD (BPL) (INDIA)
CROMPTON GREAVES LTD (INDIA)
CROWN EQUIPMENT PTY LTD (AUSTRALIA)
FUJI ELECTRIC HOLDINGS COMPANY, LIMITED, (JAPAN)
FUJITSU LIMITED (JAPAN)
KHAITAN (INDIA)
OMRON CORPORATION (JAPAN)
PANASONIC ELECTRIC WORKS CO., LTD (JAPAN)
RICOH COMPANY, LTD (JAPAN)
SANYO SEMICONDUCTOR CO., LTD (JAPAN)
SOYO SYSTEMS (INDIA)
TDK (JAPAN)
TOSHIBA (JAPAN)
VOLTAS LIMITED (INDIA)

EUROPE
SIEMENS AG (GERMANY)
STMICROELECTRONICS (ST) (SWITZERLAND)

LATIN AMERICA
WEG INDUSTRIES (BRAZIL)


To order this report: Industrial Electronics - Global Trends, Estimates and Forecasts, 2011-2018
http://www.reportlinker.com/p01931098/Industrial-Electronics---Global-Trends-Estimates-and-Forecasts-2011-2018.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Manufacturing

__________________________
Contact Clare: [email protected]
US: (339)-368-6001
Intl: +1 339-368-6001

SOURCE Reportlinker

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@CloudExpo Stories
DevOps tends to focus on the relationship between Dev and Ops, putting an emphasis on the ops and application infrastructure. But that’s changing with microservices architectures. In her session at DevOps Summit, Lori MacVittie, Evangelist for F5 Networks, will focus on how microservices are changing the underlying architectures needed to scale, secure and deliver applications based on highly distributed (micro) services and why that means an expansion into “the network” for DevOps.
"We have a tagline - "Power in the API Economy." What that means is everything that is built in applications and connected applications is done through APIs," explained Roberto Medrano, Executive Vice President at Akana, in this SYS-CON.tv interview at 16th Cloud Expo, held June 9-11, 2015, at the Javits Center in New York City.
Containers have changed the mind of IT in DevOps. They enable developers to work with dev, test, stage and production environments identically. Containers provide the right abstraction for microservices and many cloud platforms have integrated them into deployment pipelines. DevOps and Containers together help companies to achieve their business goals faster and more effectively. In his session at DevOps Summit, Ruslan Synytsky, CEO and Co-founder of Jelastic, reviewed the current landscape of...
"AgilData is the next generation of dbShards. It just adds a whole bunch more functionality to improve the developer experience," noted Dan Lynn, CEO of AgilData, in this SYS-CON.tv interview at 16th Cloud Expo, held June 9-11, 2015, at the Javits Center in New York City.
The Internet of Things is not only adding billions of sensors and billions of terabytes to the Internet. It is also forcing a fundamental change in the way we envision Information Technology. For the first time, more data is being created by devices at the edge of the Internet rather than from centralized systems. What does this mean for today's IT professional? In this Power Panel at @ThingsExpo, moderated by Conference Chair Roger Strukhoff, panelists addressed this very serious issue of pro...
"We provide a web application framework for building really sophisticated web applications that run on a browser without any installation need so we get used for biotech, defense, and banking applications," noted Charles Kendrick, CTO and Chief Architect at Isomorphic Software, in this SYS-CON.tv interview at @DevOpsSummit (http://DevOpsSummit.SYS-CON.com), held June 9-11, 2015, at the Javits Center in New York
Discussions about cloud computing are evolving into discussions about enterprise IT in general. As enterprises increasingly migrate toward their own unique clouds, new issues such as the use of containers and microservices emerge to keep things interesting. In this Power Panel at 16th Cloud Expo, moderated by Conference Chair Roger Strukhoff, panelists addressed the state of cloud computing today, and what enterprise IT professionals need to know about how the latest topics and trends affect t...
Explosive growth in connected devices. Enormous amounts of data for collection and analysis. Critical use of data for split-second decision making and actionable information. All three are factors in making the Internet of Things a reality. Yet, any one factor would have an IT organization pondering its infrastructure strategy. How should your organization enhance its IT framework to enable an Internet of Things implementation? In his session at @ThingsExpo, James Kirkland, Red Hat's Chief Arch...
In the midst of the widespread popularity and adoption of cloud computing, it seems like everything is being offered “as a Service” these days: Infrastructure? Check. Platform? You bet. Software? Absolutely. Toaster? It’s only a matter of time. With service providers positioning vastly differing offerings under a generic “cloud” umbrella, it’s all too easy to get confused about what’s actually being offered. In his session at 16th Cloud Expo, Kevin Hazard, Director of Digital Content for SoftL...
"A lot of the enterprises that have been using our systems for many years are reaching out to the cloud - the public cloud, the private cloud and hybrid," stated Reuven Harrison, CTO and Co-Founder of Tufin, in this SYS-CON.tv interview at 16th Cloud Expo, held June 9-11, 2015, at the Javits Center in New York City.
One of the hottest areas in cloud right now is DRaaS and related offerings. In his session at 16th Cloud Expo, Dale Levesque, Disaster Recovery Product Manager with Windstream's Cloud and Data Center Marketing team, will discuss the benefits of the cloud model, which far outweigh the traditional approach, and how enterprises need to ensure that their needs are properly being met.
The time is ripe for high speed resilient software defined storage solutions with unlimited scalability. ISS has been working with the leading open source projects and developed a commercial high performance solution that is able to grow forever without performance limitations. In his session at Cloud Expo, Alex Gorbachev, President of Intelligent Systems Services Inc., shared foundation principles of Ceph architecture, as well as the design to deliver this storage to traditional SAN storage co...
"Plutora provides release and testing environment capabilities to the enterprise," explained Dalibor Siroky, Director and Co-founder of Plutora, in this SYS-CON.tv interview at @DevOpsSummit, held June 9-11, 2015, at the Javits Center in New York City.
It is one thing to build single industrial IoT applications, but what will it take to build the Smart Cities and truly society-changing applications of the future? The technology won’t be the problem, it will be the number of parties that need to work together and be aligned in their motivation to succeed. In his session at @ThingsExpo, Jason Mondanaro, Director, Product Management at Metanga, discussed how you can plan to cooperate, partner, and form lasting all-star teams to change the world...
SYS-CON Events announced today that JFrog, maker of Artifactory, the popular Binary Repository Manager, will exhibit at SYS-CON's @DevOpsSummit Silicon Valley, which will take place on November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA. Based in California, Israel and France, founded by longtime field-experts, JFrog, creator of Artifactory and Bintray, has provided the market with the first Binary Repository solution and a software distribution social platform.
In his session at 16th Cloud Expo, Simone Brunozzi, VP and Chief Technologist of Cloud Services at VMware, reviewed the changes that the cloud computing industry has gone through over the last five years and shared insights into what the next five will bring. He also chronicled the challenges enterprise companies are facing as they move to the public cloud. He delved into the "Hybrid Cloud" space and explained why every CIO should consider ‘hybrid cloud' as part of their future strategy to achi...
"We got started as search consultants. On the services side of the business we have help organizations save time and save money when they hit issues that everyone more or less hits when their data grows," noted Otis Gospodnetić, Founder of Sematext, in this SYS-CON.tv interview at @DevOpsSummit, held June 9-11, 2015, at the Javits Center in New York City.
Internet of Things is moving from being a hype to a reality. Experts estimate that internet connected cars will grow to 152 million, while over 100 million internet connected wireless light bulbs and lamps will be operational by 2020. These and many other intriguing statistics highlight the importance of Internet powered devices and how market penetration is going to multiply many times over in the next few years.
Internet of Things (IoT) will be a hybrid ecosystem of diverse devices and sensors collaborating with operational and enterprise systems to create the next big application. In their session at @ThingsExpo, Bramh Gupta, founder and CEO of robomq.io, and Fred Yatzeck, principal architect leading product development at robomq.io, discussed how choosing the right middleware and integration strategy from the get-go will enable IoT solution developers to adapt and grow with the industry, while at th...
The most often asked question post-DevOps introduction is: “How do I get started?” There’s plenty of information on why DevOps is valid and important, but many managers still struggle with simple basics for how to initiate a DevOps program in their business. They struggle with issues related to current organizational inertia, the lack of experience on Continuous Integration/Delivery, understanding where DevOps will affect revenue and budget, etc. In their session at DevOps Summit, JP Morgenthal...