Welcome!

IoT User Interface Authors: AppDynamics Blog, Dana Gardner, Liz McMillan, Elizabeth White, Yakov Fain

News Feed Item

Samsung Delivers Strong 14nm FinFET Logic Process and Design Infrastructure for Advanced Mobile SoC Customers

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor solutions, today announced that it reached another milestone in the development of 14-nanometer (nm) FinFET process technology with the successful tape-out of multiple development vehicles in collaboration with its key design and IP partners. In addition, Samsung has signed an agreement with ARM® for 14nm physical IP and libraries. This agreement is the latest in a series from Samsung and ARM that has delivered production proven SoC enablement. Samsung, together with its ecosystem partners, is in a position to offer leading edge customers a robust design infrastructure to drive an ever expanding advanced mobile SoC market.

“As we move closer to true mobile computing, chip designers are eager to take advantage of the gains in performance and significantly lower power of 14nm FinFET to deliver PC like user experience on a mobile device,” said Dr. Kyu-Myung Choi, senior vice president of System LSI infrastructure design center, Device Solutions Division, Samsung Electronics. “The design complexities at 14nm require complete harmony between the process technology, design methodology, tools and IPs. We are synchronizing all the key elements so our customers can deliver their newest chips to market quickly and efficiently.”

As part of its 14nm FinFET development process, Samsung, and its ecosystem partners – ARM, Cadence, Mentor and Synopsys – taped out multiple test chips ranging from a full ARM® Cortex™-A7 processor implementation to a SRAM-based chip capable of operation near threshold voltage levels as well as an array of analog IP.

The full ARM Cortex-A7 processor test chip tape-out represents a significant milestone for silicon manufacturing for the fabless ecosystem. The Cortex-A7 implementation on FinFET demonstrates the low-power component of the ARM big.LITTLE™ processor configuration/technology strategy for mobile computing platforms. The Samsung 14nm FinFET enablement for SoC design provides improved leakage and dynamic power advantages to the expanding mobile computing market. This collaboration builds on the long-standing partnership between Samsung and ARM including SoC design enablement for the production proven 32/28nm High-K Metal Gate (HKMG) technology. Enabling SoC design on FinFET allows the continued fast pace of innovation that is the hallmark of the mobile market segment.

The Cortex-A7 processor test chip was implemented by Cadence in collaboration with ARM and Samsung. Cadence delivered a full RTL-to-signoff flow, building upon a tool set that has been thoroughly tested on 20nm designs requiring automated double patterning. The tight collaboration with Samsung and ARM enabled Cadence to hone its technology for 14nm FinFET designs, paving the way for 14nm market readiness. ARM used Cadence tools to develop the 14nm FinFET libraries, and Cadence tools were also used for a full-flow RTL-to-signoff tapeout of the processor core on Samsung’s 14nm FinFET process, as well as chip-level integration and verification.

Samsung used Synopsys tools optimized for FinFET devices to implement additional IP on this vehicle, including low power SRAMs intended to operate with the power supply close to threshold voltage levels. The move from two-dimensional transistors to three-dimensional transistors introduces several new IP and EDA tool challenges including modeling. The multi-year collaboration between Samsung and Synopsys has delivered foundational modeling technologies for 3D parasitic extraction, circuit simulation and physical design-rule support of FinFET devices.

Samsung is also extending their work with Mentor to enable a complete solution at 14nm FinFET that addresses customer challenges in design, validation, manufacturing co-optimization, and post-design production ramps. The collaborative efforts leverage the unique capabilities of Samsung’s processes, while helping designers deal with the complexities of multi-patterning lithography, FinFET transistors, and more complex reliability requirements.

Silicon-based PDK Availability

With its process design kit available to customers today, customers can start designing with models, design rule manuals and technology files that have been developed based on silicon results from previous 14nm FinFET test chips run in Samsung’s R&D facilities. This PDK includes design flows, routers and other design enablement features to support new device structures, local interconnects, and advanced routing rules. The investments that Samsung is making into the entire ecosystem at 14nm will give customers early access to all elements of the design infrastructure to accelerate their chip development.

About Samsung Electronics Co., Ltd.

Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2011 consolidated sales of US$143.1 billion. Employing approximately 227,000 people in 203 offices across 75 countries, the company operates two separate organizations to coordinate its nine independent business units: Digital Media & Communications, comprising Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, and Digital Imaging; and Device Solutions, consisting of Memory, System LSI and LED. For more information, please visit www.samsung.com.

Samsung and the stylized Samsung design are trademarks and service marks of Samsung Electronics Co., Ltd. Other trademarks are the property of their respective owners.

Partner Quotes

ARM

"Implementing the Cortex-A7 processor-based test chip on the 14nm FinFET process combines the most energy-efficient ARM applications processor with Samsung’s advanced low-power manufacturing process to demonstrate our ongoing commitment to low-power leadership. Our early collaboration with Samsung during its process technology development helps optimize ARM Artisan® physical IP and maximize the benefits available from advanced silicon manufacturing."
Dr. Dipesh Patel
Vice President and General Manager, Physical IP Division
ARM

Cadence

“Our leading-edge customers see the performance and low-power advantages of 14nm FinFET design, and they’ve asked us to help them get there ASAP. The Cadence end-to-end design flow including signoff enables engineers working along the cutting edge to bring the benefits of 14nm FinFET design to the mobile and server markets.”
Dr. Chi-Ping Hsu
Senior Vice President, Research and Development, Silicon Realization Group
Cadence

Mentor Graphics

“Mentor and Samsung continue to be committed to providing the most advanced solutions for our mutual customers in both semiconductor process technology, and the associated ecosystem required to leverage new offerings like FinFET transistors. Mentor has always driven its technology development in partnership with key customers. Our collaboration with Samsung is yielding results that designers can access immediately.”
Joseph Sawicki
Vice President and General Manager, Design to Silicon Division
Mentor Graphics

Synopsys

"Our successful 14nm FinFET tapeouts with Samsung represent a major milestone in the multi-year collaboration between Samsung and Synopsys to deliver optimized FinFET-ready EDA tool and IP enablement for the node."
John Chilton
Sr Vice President, Marketing & Strategic Development
Synopsys

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@CloudExpo Stories
SYS-CON Events announced today that Enzu, a leading provider of cloud hosting solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Enzu’s mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive advantage. By offering a suite of proven hosting and management services, Enzu wants companies to foc...
So, you bought into the current machine learning craze and went on to collect millions/billions of records from this promising new data source. Now, what do you do with them? Too often, the abundance of data quickly turns into an abundance of problems. How do you extract that "magic essence" from your data without falling into the common pitfalls? In her session at @ThingsExpo, Natalia Ponomareva, Software Engineer at Google, will provide tips on how to be successful in large scale machine lear...
SYS-CON Events announced today that Stratoscale, the software company developing the next generation data center operating system, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Stratoscale is revolutionizing the data center with a zero-to-cloud-in-minutes solution. With Stratoscale’s hardware-agnostic, Software Defined Data Center (SDDC) solution to store everything, run anything and scale everywhere...
Angular 2 is a complete re-write of the popular framework AngularJS. Programming in Angular 2 is greatly simplified – now it's a component-based well-performing framework. This immersive one-day workshop at 18th Cloud Expo, led by Yakov Fain, a Java Champion and a co-founder of the IT consultancy Farata Systems and the product company SuranceBay, will provide you with everything you wanted to know about Angular 2.
You think you know what’s in your data. But do you? Most organizations are now aware of the business intelligence represented by their data. Data science stands to take this to a level you never thought of – literally. The techniques of data science, when used with the capabilities of Big Data technologies, can make connections you had not yet imagined, helping you discover new insights and ask new questions of your data. In his session at @ThingsExpo, Sarbjit Sarkaria, data science team lead ...
SYS-CON Events announced today that Men & Mice, the leading global provider of DNS, DHCP and IP address management overlay solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. The Men & Mice Suite overlay solution is already known for its powerful application in heterogeneous operating environments, enabling enterprises to scale without fuss. Building on a solid range of diverse platform support,...
SYS-CON Events announced today that Peak 10, Inc., a national IT infrastructure and cloud services provider, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Peak 10 provides reliable, tailored data center and network services, cloud and managed services. Its solutions are designed to scale and adapt to customers’ changing business needs, enabling them to lower costs, improve performance and focus inter...
You deployed your app with the Bluemix PaaS and it's gaining some serious traction, so it's time to make some tweaks. Did you design your application in a way that it can scale in the cloud? Were you even thinking about the cloud when you built the app? If not, chances are your app is going to break. Check out this webcast to learn various techniques for designing applications that will scale successfully in Bluemix, for the confidence you need to take your apps to the next level and beyond.
Whether your IoT service is connecting cars, homes, appliances, wearable, cameras or other devices, one question hangs in the balance – how do you actually make money from this service? The ability to turn your IoT service into profit requires the ability to create a monetization strategy that is flexible, scalable and working for you in real-time. It must be a transparent, smoothly implemented strategy that all stakeholders – from customers to the board – will be able to understand and comprehe...
See storage differently! Storage performance problems have only gotten worse and harder to solve as applications have become largely virtualized and moved to a cloud-based infrastructure. Storage performance in a virtualized environment is not just about IOPS, it is about how well that potential performance is guaranteed to individual VMs for these apps as the number of VMs keep going up real time. In his session at 18th Cloud Expo, Dhiraj Sehgal, in product and marketing at Tintri, will discu...
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
Increasing IoT connectivity is forcing enterprises to find elegant solutions to organize and visualize all incoming data from these connected devices with re-configurable dashboard widgets to effectively allow rapid decision-making for everything from immediate actions in tactical situations to strategic analysis and reporting. In his session at 18th Cloud Expo, Shikhir Singh, Senior Developer Relations Manager at Sencha, will discuss how to create HTML5 dashboards that interact with IoT devic...
Artificial Intelligence has the potential to massively disrupt IoT. In his session at 18th Cloud Expo, AJ Abdallat, CEO of Beyond AI, will discuss what the five main drivers are in Artificial Intelligence that could shape the future of the Internet of Things. AJ Abdallat is CEO of Beyond AI. He has over 20 years of management experience in the fields of artificial intelligence, sensors, instruments, devices and software for telecommunications, life sciences, environmental monitoring, process...
Peak 10, Inc., has announced the implementation of IT service management, a business process alignment initiative based on the widely adopted Information Technology Infrastructure Library (ITIL) framework. The implementation of IT service management enhances Peak 10’s current service-minded approach to IT delivery by propelling the company to deliver higher levels of personalized and prompt service. The majority of Peak 10’s operations employees have been trained and certified in the ITIL frame...
SYS-CON Events announced today that Ericsson has been named “Gold Sponsor” of SYS-CON's @ThingsExpo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. Ericsson is a world leader in the rapidly changing environment of communications technology – providing equipment, software and services to enable transformation through mobility. Some 40 percent of global mobile traffic runs through networks we have supplied. More than 1 billion subscribers around the world re...
There is an ever-growing explosion of new devices that are connected to the Internet using “cloud” solutions. This rapid growth is creating a massive new demand for efficient access to data. And it’s not just about connecting to that data anymore. This new demand is bringing new issues and challenges and it is important for companies to scale for the coming growth. And with that scaling comes the need for greater security, gathering and data analysis, storage, connectivity and, of course, the...
SYS-CON Events announced today that DatacenterDynamics has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY. DatacenterDynamics is a brand of DCD Group, a global B2B media and publishing company that develops products to help senior professionals in the world's most ICT dependent organizations make risk-based infrastructure and capacity decisions.
Between the mockups and specs produced by analysts, and resulting applications built by developers, there exists a gulf where projects fail, costs spiral, and applications disappoint. Methodologies like Agile attempt to address this with intensified communication, with partial success but many limitations. In his session at 18th Cloud Expo, Charles Kendrick, CTO & Chief Architect at Isomorphic Software, will present a revolutionary model enabled by new technologies. Learn how business and devel...
If there is anything we have learned by now, is that every business paves their own unique path for releasing software- every pipeline, implementation and practices are a bit different, and DevOps comes in all shapes and sizes. Software delivery practices are often comprised of set of several complementing (or even competing) methodologies – such as leveraging Agile, DevOps and even a mix of ITIL, to create the combination that’s most suitable for your organization and that maximize your busines...
Struggling to keep up with increasing application demand? Learn how Platform as a Service (PaaS) can streamline application development processes and make resource management easy.