SYS-CON Events announced today that nfina Technologies, a provider of highly reliable cloud server products, will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10–13, 2013, at the Javits Center in New York City, New York.
nfina Technologies develops, manufactures, and markets highly reliable cloud server products, designed to solve the most demanding data center requirements in mission-critical cloud applications. Nfina’s staff has decades of experience in co...| By Business Wire | Article Rating: |
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| December 5, 2012 09:08 AM EST | Reads: |
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Interlink Electronics, Inc. (OTC: LINK) announced today the launch of their new Hardware Development Kits that offer out of the box sensor technologies solutions, ready to be implemented in all next generation products that require force & position sensors and mouse & pointing solutions.
Packaged for testing and learning about FSR® technology, the Hardware Development Kits (HDKs) provide all the necessary components for engineers and developers to realize their own designs.
The Hardware Development Kits include:
The FSR® 400 series kit – ideal for implementation in human touch control of electronic devices such as automotive electronics, medical systems and industrial PCs. Force Sensing Resistors (FSR®) are robust, polymer thick film (PTF) devices that exhibit a decrease in resistance when increased pressure is applied to the surface of the sensor.
The VersaPad® kit includes a versatile touchpad module intended for integration by OEMs into laptops, military and rugged computers, panel PCs and medical devices. With smoothness and sensitivity internally enhanced by true pressure measurement, it offers all customary mouse functions – mousing, tapping, dragging, and scrolling. The module's tough, moisture and grime resistant surface can be used with a finger or stylus, even in wet or dirty environments and it operates over an extended temperature range of -20°C to +60°C.
The 4-zone mousing Hardware Development Kit (HDK) is the perfect tool to evaluate this unique mouse pointing solution. The HDK provides all the necessary components to understand and evaluate how to implement accurate 360-degree mouse control.
The Ring Sensor kit enables intuitive scrolling and menu navigation functionality for consumer electronic devices in an easy to integrate, high resolution, ultra low-power package. It is ideal for media players, mobile phones, control panels, medical instruments, and home entertainment devices to control streaming media, audio, balance, menus, play lists and gaming functions that involve rotation and steering. The sensor can be integrated directly into the device's host processor without the need for a dedicated microprocessor.
The Interlink Force Sensing Linear Potentiometer (FSLP) is a linear position sensor for menu navigation and control. It functions as a linear potentiometer with the ability to detect a user's force for high rate scrolling and a more intuitive user experience. The FSLP is an easy to integrate, high resolution, ultra low-power package.
The MicroModule is a finger-actuated "mouse" pointing module that provides complete 360-degree directional control and accurate speed control simultaneously. It is ideal for computer cursor control in rugged mobile computers, hardened keyboards, navigation systems, machine control panels, pan and tilt controllers, motion controllers, CNC controllers and medical control equipment. It's a durable, maintenance-free "miniature" solution that works well in tight spaces and is capable of delivering "mouse" lifetimes of more than 3 million actuations.
The Micro Joystick Hardware Development Kit (HDK) includes the high-precision Micro Joystick solution which is an innovative, intuitive, OEM pointing system that delivers simultaneous 360-degree control of direction and speed at the touch of a fingertip.
“Our objective with these development kits was to make it simple for designers and engineers to understand the versatility, simplicity and ease of use of our technology,” said Declan Flannery, Chief Operating officer of Interlink Electronics. “In today’s competitive environment short development time can provide a critical advantage. The kits will save designers and engineers valuable time, effort and money while at the same time shortening the product development cycle.”
The out of the box Hardware Development Kits from Interlink Electronics are turnkey solutions for any engineer or developer ready to design a successful next generation product. For more information go to: http://www.interlinkelectronics.com/products.php
About Interlink Electronics, Inc.
Interlink Electronics, Inc. (OTC: LINK) is a sensor technology company and one of the world’s leading innovators of intuitive interface design. With numerous patents around the world protecting its technologies and products, Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California and offices in Japan, Hong Kong and China. For more information, see http://www.interlinkelectronics.com.
This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink, historical weaknesses in internal controls over financial accounting, the continued availability at competitive prices of raw materials for our products, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.
Published December 5, 2012 Reads 155
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SYS-CON Events announced today that nfina Technologies, a provider of highly reliable cloud server products, will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10–13, 2013, at the Javits Center in New York City, New York.
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In his session at the 12th International Cloud Expo, Dave Eichorn, Global Data Center Practice Head at Zensar, will share a case study describing how a utility services company handled the migration of its Microsoft platform to the cloud. Challenged with the time-consuming task of opening operations out of temporary offices, this company struggled with the need to simultaneously access data that was accumulated from a vast amount of data-intensive jobs. Zensar migrated the company’s application ...
“Social, mobile, analytics and cloud can’t be looked at as distinct technology trends; they are facets of the same movement and an everyday reality for consumers and businesses alike,” said Craig Sowell, IBM VP of SmartCloud Marketing, in this exclusive Q&A with Cloud Expo Conference Chair Jeremy Geelan. “This means that businesses need to start looking at trends as one: cloud is the delivery, analytics is the unique insight, social is a shareable service, and mobile is the ubiquitous access.”
...
Organizations across the world are increasingly starting to see the benefits of moving more and more services to the cloud. The focus on the cost-saving potential of cloud is rapidly shifting to completely transforming the business with cloud. As organizations are investing enormous sums on technology they are starting to realize that in order to maximize the return on investment and accelerate the business transformation process the first area of focus should be people. By ensuring the organiza...
SYS-CON Events announced today that Wowrack will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10–13, 2013, at the Javits Center in New York City, New York.
Wowrack’s core expertise lies in high-availability Private and Public Cloud IaaS Hosting Solutions. Wowrack provides a true Hybrid service – where business release all IT management and hardware provisioning – taking the data center and server system administrative headaches off our customer’s shoulders. ...
As enterprises deploy private IaaS clouds into production they are reevaluating their future application delivery models. SUSE and WSO2 believe that private PaaS will leverage the automation and scalability of Private IaaS solutions, such as OpenStack-based SUSE Cloud, to deliver the secure, standardized development environments that will make migrating to an agile, serviceoriented delivery model possible.
In their session at the 12th International Cloud Expo, Chris Haddad, VP of Technology Ev...
"Since Cloud Expo is running the week of June 10, we thought it'd be a great idea to schedule our Meetup this week. That way, if you have colleagues, friends, or family in town that week for the Expo, you can invite them to join you!" With those words, the OpenStack New York Meetup Group's organizer's launched a landing page this week where anyone interested can register for the June 12 evening event.
In an ideal developer/systems administrator’s world, most applications would deploy seamlessly to multiple platforms and scale elastically with minimal effort bringing the unprecedented agility of the cloud within immediate reach of developer teams and IT organizations.
OpenStack, a RackSpace and NASA initiative, is now managed by an independent foundation and is supported by multiple vendors. It defines APIs for compute, storage, networking, services, monitoring, and additional infrastructure...
In his session at 12th Cloud Expo | Cloud Expo New York [June 10-13, 2013], Intel's Chris Black will review the background of Apache Hadoop, its application, and methods to accelerate data system clusters with Intel SSD technology. The session will overview the genius of Hadoop and provide an overview of the ecosystem landscape.
Cloud Expo/Big Data Expo delegates will learn how the Hadoop framework and SSD technology augment cloud data systems ranging from analytics to on-line transaction pro...
Cloud computing is transforming the way businesses think about and leverage technology. As a result, the general understanding of cloud computing has come a long way in a short time. However, there are still many misconceptions about what cloud computing is and what it can do for businesses that adopt this game-changing computing model.
In his General Session at the 12th International Cloud Expo, Gene Eun, Senior Director, Oracle Cloud at Oracle, will discuss and dispel some of the common myth...
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